Instant online PCB pricing · Turnkey assembly with sourced components · Export documents included
PCB Capabilities
Use this page to confirm whether your stack-up, geometry, and finishes fit our standard process window before you open the quote tool. Specs below reflect our standard process; other builds can be reviewed via RFQ.
| Parameter | Capability |
|---|---|
| Layer count | 1–20 layers |
| Material | FR-4 (Tg130/150/170), Aluminum core, Copper core, Flex (polyimide); other materials on review via RFQ |
| Board thickness | 0.4–3.0 mm |
| Board size | 10 × 10 mm – 600 × 500 mm |
| Tg | Tg130 / Tg150 / Tg170 (material dependent) |
| Parameter | Capability |
|---|---|
| Outer copper | 1–2 oz; heavier copper on review via RFQ |
| Inner copper | 0.5–2 oz; heavier copper on review via RFQ |
| Min trace / space | 3.5 / 3.5 mil (approximately 0.09 / 0.09 mm), subject to layer and copper-weight requirements; finer features on review via RFQ |
| Min finished hole | 0.15 mm |
| Hole size tolerance | ±0.05 mm (PTH); ±0.025 mm (NPTH typical) |
| Annular ring | ≥ 0.1 mm (4 mil) recommended |
| Parameter | Capability |
|---|---|
| Solder mask colors | Green, Matte Green, Blue, Red, Yellow, Black, Matte Black, White, Purple |
| Silkscreen colors | White, Black, None |
| Min solder mask dam | 0.1 mm (4 mil) |
| Parameter | Capability |
|---|---|
| Available finishes | HASL, Lead-free HASL, ENIG |
| ENIG thickness | Au 1–3 µin over Ni 120–200 µin (typical) |
| Parameter | Capability |
|---|---|
| Impedance control | Single-ended / differential; ±10% typical |
| Gold fingers | On review via RFQ |
| Via fill | Resin plug / via in pad (on review) |
| Blind / buried vias | On review via RFQ |
| Castellated holes | Supported |
| V-CUT / scoring | Supported |
| Breakaway Tabs with Mouse-Bite Holes | Supported |
| Parameter | Capability |
|---|---|
| Flying probe | Standard for prototypes / small volume |
| Fixture-Based Electrical Testing (Bed of Nails) | Available for volume; NRE may apply |
| AOI | Standard process control |
| Parameter | Capability |
|---|---|
| Impedance control | Per stack-up / coupon set |
| Gold fingers | Per edge / gold area |
| Via in pad / resin plug | Per panel complexity |
| HDI blind/buried | Per step & layer pair |
| Electrical test fixture | One-time NRE |
| Expedite fee | Per lead-time option on the quote page |
Final extras appear in the quote breakdown. Additional charges depend on process requirements and are shown in the quotation.
Production lead time depends on layer count, quantity and process. The quote page shows the estimated dates for your board. Shipping time is additional.
Submit Gerber (RS-274X) files in a zip, rar or 7z archive. Clear layer naming speeds DFM review and reduces questions.
Jump into the instant PCB quote with your layers, size, and quantity.
